Less Costs S6 Spark Plasma Sintering Furnace

The spark plasma sintering system is one of the most advanced sintering systems in the world today. It is a new type of rapid sintering technology that applies pulse current and axial pressure between two electrodes for powder sintering densification. It has the distinctive characteristics of fast heating rate, short sintering time, controllable structure, energy saving and environmental protection. It can be used to prepare metal materials, ceramic materials, composite materials, nano block materials, amorphous block materials, gradient materials.

Technical Data

Rapid heating and cooling, greatly shortening production time and reducing production costs (heating rate can reach 100 ~ 200℃ / min).

Self-developed high efficiency and energy saving power supply

Adopting self-developed pulse frequency conversion DC power supply, The current output is stable and the power consumption is greatly reduced, energy saving and environmental protection.

Precised pressure control system

Servo valve is used to control the pressure output of the hydraulic cylinder, and the control accuracy can reach 1/1000.

Thermocouple and two-color infrared instrument are used to measure the temperature.

Advanced automatic control and reliable safety interlock

Adopting computer to realize automatic control of temperature and action process, PLC safety interlock. It has sound and light alarm and interlock function such as over-pressure, over-temperature and high water temperature.


                                                                     S6 Spark Plasma Sintering System
Equipment Loading MethodHorizontal side loading
Output Voltage0 ~ 10V
Output Current0 ~ 30000A
Pulse ControlON/1~255ms OFF/1~255ms
Max. Sintering Temp2200℃(The temperature will change according to the resistance of the sintered material)
Product Diameter≤φ150mm
Mold Diameter≤φ550mm
Open Height650mm
Z-axis stroke200mm
Displacement Accuracy±0.005mm
Max. Pressure100KN(100Ton)
Pressure ControlServo Hydraulic
Pressure Accuracy±0.1%
Pressure methodSingle-way pressure, bottom pressure
Max.Vacuum1Pa/8.0×10-4Pa(8.0×10-2 torr/8.0×10-6 torr)Optional
Pressure Rise Rate≤ 2Pa/h
Temperature Control and  MeasurementPLC program temperature control
≤1000℃  with K-type thermal couple
>1000℃ with infrared thermometer
GasesHigh-purity argon or high-purity nitrogen, inflation pressure ≤0.02MPa (adjustable)
Cooling Water RequirementsWater pressure 0.2 ~ 0.4MPa


Sintered nanomaterial without significant grain growth

1.FGM (Functionally Graded Materials)

2.Composite materials

3.Innovative carbide metals

4.Aluminum and copper alloys as well as intermetallic compounds

5.Structural and functional ceramics

6.Electronic Materials 

7.Sputtering target material

8.Bioma materials

9.Porous materials

10.Magnetic materials

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